How the technology works

From engineered particles to infrastructure performance

Aesyon's platform is a materials capability: a controlled way of engineering copper so it can be formulated into products that perform in demanding electrical and thermal environments.

Process flow

Four stages, one platform

01

Raw copper input

The platform starts from abundant, broadly available copper feedstock rather than scarce precious metals.

02

Particle engineering

Copper is engineered at the particle level — controlling structure and surface behavior to address oxidation and stability limits.

03

Material formulation

Engineered particles are formulated into processable inks, pastes and compounds tuned to each application's process window.

04

Application performance

The resulting materials are designed to deliver reliable conductive performance in real production hardware.

Why Aesyon copper is different

Copper Is the Material. Chemistry Is the Enabler.

Copper offers compelling electrical, thermal, economic, and supply-chain characteristics, but oxidation and processing limitations have historically restricted its use in certain high-performance applications.

Aesyon combines engineered copper particles with proprietary antioxidant chemistry designed to limit oxidation, enable lower-temperature processing, and improve compatibility with industrial manufacturing.

Actual Aesyon engineered copper particle powder sample

Platform progression

  1. Particle Engineering→
  2. Functional Chemistry→
  3. Formulation→
  4. Manufacturing Process→
  5. Component→
  6. Energy Infrastructure

Designing materials with predictable functionality

Engineering Copper for Predictable Functionality

Designing material behavior around the requirements of the application.

Aesyon's platform is designed to do more than substitute copper for higher-cost materials.

By combining particle engineering, functional chemistry, formulation, and process control, Aesyon is developing copper-based materials whose electrical, thermal, processing, and mechanical characteristics can be tailored around specific application requirements.

Particle engineering+
Functional chemistry+
Formulation+
Process control
↓Predictable functionality↓Application-specific performance

Electrical Performance

Develop formulations around the conductivity required by the application.

Processing Behavior

Control oxidation and curing behavior to support lower-temperature, commercially relevant manufacturing processes.

Mechanical & Material Properties

Use chemistry and formulation as pathways to tune material characteristics for application-specific requirements.

Manufacturing Compatibility

Design material functionality alongside the process in which it will ultimately be manufactured.

Copper is the material. Engineering its behavior is the platform.

Material characteristics described here are design objectives and development pathways; performance in any specific application is under evaluation and subject to application-specific qualification testing.

Preliminary / lab-scale data

Measured performance

Low-temperature processing

Demonstrated below 140°C.

Rapid processing

Demonstrated in less than two minutes under reported laboratory conditions.

Electrical conductivity

Laboratory results on the order of 8 × 10⁶ S/m under reported test conditions.

Approximately 14% of bulk copper conductivity under the cited laboratory conditions.

Substrate compatibility

Processing conditions compatible with low-cost PET substrates.

Process advantage

Designed to reduce reliance on high-temperature processing and reducing atmospheres.

Solderability

Promising solderability demonstrated in development testing.

Performance varies by formulation, substrate, manufacturing process, and application. Application-specific validation is required. Results reported here are laboratory-scale and are not commercial qualification.

Predictable functionality

Engineered for predictable functionality

Aesyon's antioxidant chemistry provides a pathway to tailor processing behavior and material functionality for different application requirements.

Processing temperature

Formulations can be developed for different manufacturing temperature ranges.

Mechanical properties

The platform provides a pathway to tune material characteristics for application-specific requirements.

Electrical performance

Particle chemistry and formulation can be optimized around required conductive performance.

Application flexibility

The same underlying materials platform can support multiple application-specific formulations.

These characteristics describe development pathways enabled by the platform. Not every characteristic has been commercially demonstrated.

Manufacturing compatibility

Designed for existing manufacturing

A lower-cost material creates limited value if adoption requires customers to rebuild their manufacturing process.

Aesyon's copper formulations are being developed to minimize process-flow changes from established conductive-material manufacturing methods.

Common printing methods

Designed for compatibility with established industrial printing processes.

Lower processing temperatures

Designed to broaden compatibility with commercially relevant substrates.

Reduced process complexity

Aesyon's chemistry is intended to reduce dependence on specialized reducing atmospheres and high-temperature processing.

Solderability

Designed to support integration with established electronics assembly processes.

Material substitution must work technically, economically, and operationally.

Application validation

Prove performance and economics one application at a time.

Aesyon's commercialization strategy is based on validating specific formulations in commercially relevant applications before broader market expansion.

  1. Lab Validation→
  2. Customer Evaluation→
  3. Application Demonstration→
  4. Small-Batch Production→
  5. Toll Manufacturing→
  6. Commercial Production

Application

Printed conductive traces

Incumbent material
Silver conductive paste / ink
Required performance
Conductive traces printable with established industrial printing processes
Aesyon formulation
Engineered copper particles with antioxidant chemistry, low-temperature cure
Test status
Laboratory demonstration
Economic opportunity
Material-cost reduction from copper feedstock substitution
Qualification status
Qualification planned

Application

RFID antennas

Incumbent material
Silver conductive ink / Etched Copper
Required performance
High-volume roll-to-roll printing on low-cost substrates
Aesyon formulation
Screen-printable copper formulation for PET substrates
Test status
Application development
Economic opportunity
Conductive material cost is a significant share of tag cost
Qualification status
Qualification planned

Application

EMI / EMF shielding

Incumbent material
Silver-loaded and metal-filled coatings
Required performance
Continuous conductive coverage with process compatibility
Aesyon formulation
Copper-based conductive coating formulation
Test status
Customer evaluation
Economic opportunity
Cost reduction in shielding material content
Qualification status
Qualification planned

Status labels describe internal development stage only. No customer results, endorsements or completed qualifications are implied.

Technology foundation

3 Foundational Patents

Proprietary antioxidant chemistry and metal-compounding technology form the intellectual-property foundation of the Aesyon Energy Materials Platform.

  • Antioxidant chemistry
  • Copper and metal compounding
  • Particle and formulation know-how
  • Manufacturing process development
Actual Aesyon engineered copper powder sample

Why we win

Performance is necessary. Integration is what makes it adoptable.

Materials only scale when they fit the manufacturing reality of the customer. Aesyon designs for that constraint from the beginning.

Manufacturing compatibility

Formulated to work with established deposition and printing processes, so customers are not required to rebuild production lines.

IP protection

The platform is built on proprietary particle engineering and formulation know-how developed in-house.  

Supportive economics

Where substitution is technically viable, copper's input cost creates structural room to improve application economics alongside performance and supply benefits.

Platform business model

One core materials capability supports multiple product families across adjacent markets, rather than a single-product roadmap.

Validation

Development guided by technical and federal review

Aesyon's technology development has been supported by competitive federal research funding, including a $3M National Science Foundation award, alongside ongoing application-specific testing.

Federal research support

$3M NSF award supporting continued platform development.

Application testing

Performance and reliability evaluation conducted per target application.

Partner qualification

Customer-led qualification programs define production readiness in each market.

Technologies described here are under active development. Testing results referenced are preliminary and application-specific; qualification timelines vary by market and customer process requirements.